Abstract: Thin-wall insulated data cables incorporating chemically foamed polyolefin compounds contain a blowing agent that is thermally activated during the extrusion process, resulting in insulation with up to 40% expansion levels. However, the capability of the insulation compound to be extruded at a uniform insulation layer within physical and electrical tolerances can be limited. In this presentation, we will introduce a base resin system that can be extruded at high speeds and exhibits a foaming capability greater than 40% for thin-wall cellular insulation, using chemical foaming. The relationship between the rheological parameters and the thin-wall insulation foamed structure and expansion is discussed.
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